Nemeski@lemm.ee to Technology@lemmy.worldEnglish · 2 months agoTSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing designwww.tomshardware.comexternal-linkmessage-square2fedilinkarrow-up1129arrow-down11
arrow-up1128arrow-down1external-linkTSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing designwww.tomshardware.comNemeski@lemm.ee to Technology@lemmy.worldEnglish · 2 months agomessage-square2fedilink
minus-squareEntropywins@lemmy.worldlinkfedilinkEnglisharrow-up6·2 months agoASMLs new EUV lithography is coming out to play.
ASMLs new EUV lithography is coming out to play.